Non-electrolytic silver plating
Compatible with next-generation SiC power devices! Achieves excellent performance.
"Electroless Ag plating" is a technology from Ozic Technologies that is compatible with next-generation SiC power devices. Conventional technologies have issues such as instability in operation under high-temperature environments and an inability to meet the demands for high-performance devices, necessitating more advanced processing to accommodate SiC power devices. Our "Electroless Ag plating" can solve the challenges of conventional technologies by enabling operation in high-temperature environments through high melting point metal bonding with Ag nanoparticles. [Features] ■ Achieves excellent performance as an alternative plating to Au, such as DIG (Direct Immersion Gold) ■ Maintains quality for a long time without being affected by the substrate (such as Cu) and without oxidation ■ Supports fine wiring patterns and partial plating by forming a uniform thin film (0.1~0.5μmt) *For more details, please refer to the PDF document or feel free to contact us.
- Company：オジックテクノロジーズ
- Price：Other
